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High-Power Synchronous HBLED
Drivers with Rapid Current Pulsing
PCB Layout
Use the following guidelines to layout the LED driver.
Selector Guide
1) Place the IN, V CC , and V DD bypass capacitors
close to the MAX16821A/MAX16821B/MAX16821C.
2) Minimize the area and length of the high-current
switching loops.
3) Place the necessary Schottky diodes that are con-
nected across the switching MOSFETs very close to
the respective MOSFET.
PART
MAX16821A
MAX16821B
MAX16821C
DIFFERENTIAL
SET VALUE
(V SENSE+ - V SENSE- )
(V)
0.60
0.10
0.03
DIFFERENTIAL
AMP GAIN
(V/V)
1
6
20
4) Use separate ground planes on different layers of
the PCB for SGND and PGND. Connect both of
these planes together at a single point and make
this connection under the exposed pad of the
MAX16821A/MAX16821B/MAX16821C.
5) Run the current-sense lines CSP and CSN very
close to each other to minimize the loop area. Run
TOP VIEW
Pin Configuration
the sense lines SENSE+ and SENSE- close to each
other. Do not cross these critical signal lines with
21
20
19
18
17
16
15
power circuitry. Sense the current right at the pads
of the current-sense resistors. The current-sense
signal has a maximum amplitude of 27.5mV. To pre-
vent contamination of this signal from high dv/dt
and high di/dt components and traces, use a
ground plane layer to separate the power traces
from this signal trace.
6) Place the bank of output capacitors close to the load.
7) Distribute the power components evenly across the
SGND 22
SENSE- 23
SENSE+ 24
SGND 25
IN 26
V CC 27
V DD 28
+
MAX16821A
MAX16821B
MAX16821C
*EP
14
13
12
11
10
9
8
I.C.
OUTV
RT/SYNC
EN
MODE
CLKOUT
SGND
board for proper heat dissipation.
8) Provide enough copper area at and around the
1
2
3
4
5
6
7
switching MOSFETs, inductor, and sense resistors
to aid in thermal dissipation.
9) Use 2oz or thicker copper to keep trace inductances
and resistances to a minimum. Thicker copper con-
ducts heat more effectively, thereby reducing thermal
impedance. Thin copper PCBs compromise efficiency
in applications involving high currents.
*EP = EXPOSED PAD.
PROCESS: BiCMOS
TQFN
Chip Information
22
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相关代理商/技术参数
MAX16821EVKIT+ 制造商:Maxim Integrated Products 功能描述:HIGH-POWER SYNCHRONOUS HBLED DRIVER - Boxed Product (Development Kits)
MAX16822AASA/V+ 功能描述:LED照明驱动器 2MHz HB w/MOSFET & HSide Crnt Sense RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N
MAX16822AASA/V+T 功能描述:LED照明驱动器 2MHz HB w/MOSFET & HSide Crnt Sense RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N
MAX16822AASA+ 功能描述:LED照明驱动器 2MHz HB w/MOSFET & HSide Crnt Sense RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N
MAX16822AASA+T 功能描述:LED照明驱动器 2MHz HB w/MOSFET & HSide Crnt Sense RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N
MAX16822BASA+ 功能描述:LED照明驱动器 2MHz HB w/MOSFET & HSide Crnt Sense RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N
MAX16822BASA+T 功能描述:LED照明驱动器 2MHz HB w/MOSFET & HSide Crnt Sense RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N
MAX16822BEVKIT+ 功能描述:LED 照明开发工具 MAX16822B Eval Kit RoHS:否 制造商:Fairchild Semiconductor 产品:Evaluation Kits 用于:FL7732 核心: 电源电压:120V 系列: 封装: